Glossary - Concepts and terminology of printed circuit boards
Please select the appropriate letter:
- Conductor to Hole Spacing
- Chamfer
- Cure
- Curing Temperature
- C-Stage
- C-Stage
- CAF – Conductive Anodic Filament
- CAF – Conductive Anodic Filament
- Center to Center Spacing
- Chamfer
- Chip On Board (COB)
- Chip On Board (COB)
- Clad
- Composite Board
- Compound Die
- Conductive Foil
- Conductor Spacing
- Conductor Thickness
- Conductor to Hole Spacing
- Conductor Width
- Conformal Mask System
- Conformal Mask System
- Contact angle
- Copper Foil
- Corner Mark (Crop Mark)
- Crazing
- Cross-Linking
- Crosshatching
- CSP (Chip Size Packaging – Chip Scale Packaging)
- CTI-Werte (Cross-Tracking-Index)
- Cure
- Curing Temperature
- Current-Carrying Capacity
- Crazing
- Clad
- Compound Die
- Composite Board
- Contact angle
- Corner Mark (Crop Mark)
- Crosshatching
- Copper Foil
- Conductive Foil
- Conductor Thickness
- Conductor Spacing
- Conductor Width
- Center to Center Spacing
- Current-Carrying Capacity
- Cross-Linking
Conductor to Hole Spacing
The distance between the edge of a conductor and the edge of a supported or unsupported hole.
