Glossary - Concepts and terminology of printed circuit boards
Please select the appropriate letter:
- Conductor to Hole Spacing
- Chamfer
- Cure
- Curing Temperature
- C-Stage
- C-Stage
- CAF – Conductive Anodic Filament
- CAF – Conductive Anodic Filament
- Center to Center Spacing
- Chamfer
- Chip On Board (COB)
- Chip On Board (COB)
- Clad
- Composite Board
- Compound Die
- Conductive Foil
- Conductor Spacing
- Conductor Thickness
- Conductor to Hole Spacing
- Conductor Width
- Conformal Mask System
- Conformal Mask System
- Contact angle
- Copper Foil
- Corner Mark (Crop Mark)
- Crazing
- Cross-Linking
- Crosshatching
- CSP (Chip Size Packaging – Chip Scale Packaging)
- CTI-Werte (Cross-Tracking-Index)
- Cure
- Curing Temperature
- Current-Carrying Capacity
- Crazing
- Clad
- Compound Die
- Composite Board
- Contact angle
- Corner Mark (Crop Mark)
- Crosshatching
- Copper Foil
- Conductive Foil
- Conductor Thickness
- Conductor Spacing
- Conductor Width
- Center to Center Spacing
- Current-Carrying Capacity
- Cross-Linking
CAF – Conductive Anodic Filament
The migration of copper ions along the length of a glass fibre-bundle within a substrate material (CAF) is enhanced under conditions of high humidity, elevated temperatures and potential gradients. The phenomenon can be repressed when the glass fibres are completly wetted by the surround resin matrix and thus otally enclosed.
