Glossar - Begriffe und Terminologien von Leiterplatten
Bitte wählen Sie den passenden Anfangsbuchstaben:
- C- Zustand (Ausgehärtet)
- C-Stage
- CAF – Anodisch leitfähige Fasern
- CAF – Conductive Anodic Filament
- Center to Center Spacing
- Chamfer
- Chip On Board (COB)
- Chip On Board (COB)
- Clad
- Composite Board
- Compound Die
- Conductive Foil
- Conductor Spacing
- Conductor Thickness
- Conductor to Hole Spacing
- Conductor Width
- Conformal Mask System
- Conformal Mask System
- Contact angle
- Copper Foil
- Corner Mark (Crop Mark)
- Crazing
- Cross-Linking
- Crosshatching
- CSP (Chip Size Packaging – Chip Scale Packaging)
- CTI-Werte (Cross-Tracking-Index)
- Cure
- Curing Temperature
- Current-Carrying Capacity
Conductor Thickness
The thickness of the conductor exclusive of coatings or metals.
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