Glossar - Begriffe und Terminologien von Leiterplatten

Bitte wählen Sie den passenden Anfangsbuchstaben:

IMIDAZOL

Chemical compound of the formula C5 N2 HR3., application as agent to passivate copper in preflux. Derivated solutions are used as „OSP“ – an alternitive surface protection before soldering.

Telefon: +49 (0) 21 51 - 825 - 1