Glossar - Begriffe und Terminologien von Leiterplatten

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Plating Electroless

A method of metal deposition employing a chemical reducing agent present in a processing solution. The process is further characterized by the catalytic nature of the surface, which enables the metal to be plated to any thickness. Electroless plating can deposit metal uniformly on complicated shapes and down into recesses inaccessible to current flow. However, since this process is more expensive than electroplating, it supplements the other method. Copper, gold, and nickel are the metals most commonly electroless plated.