Glossar - Begriffe und Terminologien von Leiterplatten

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Solder Leveling

The process of dipping PCB’s into hot liquids, or exposing them to liquid waves to achieve fusion. First, flux is applied to the board by dipping or brushing. Then the board is preheated in a liquid (maintained at 250 F). Next, the board is immersed in fusing liquid at 430 – 500 F. Finally, it is dipped in another 250 F liquid to cool it and reduce thermal shock. Thin fused coatings can be applied.